IEC 61188-5 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
JIS C 5603 Terms and definitions for printed circuits
JIS C 62137-1-1:2010 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test
JIS C 62137-1-2:2010 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test
JIS C 62137-1-3:2011 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test
JIS C 62137-1-4:2011 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test
JIS C 62137-1-5:2011 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test
JIS C 6484 Base materials for printed circuits -- Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)
JIS C 62137-3:2014 history
2014JIS C 62137-3:2014 Electronics Assembly Technology.Part 3: Selection guidance of environmental and endurance test methods for solder joints