JIS C 62137-1-2:2010
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test
- Standard No.
- JIS C 62137-1-2:2010
- Release Date
- 2010
- Published By
- Japanese Industrial Standards Committee (JISC)
- Latest
- JIS C 62137-1-2:2010
JIS C 62137-1-2:2010 Referenced Document
- IEC 61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly*， 2014-02-01 Update
- IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
- IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*， 2020-07-14 Update
- JIS C 0025:1988 Basic environmental testing procedures Part 2: Tests Test N: Change of temperature
- JIS C 5603:1993 Terms and definitions for printed circuits
- JIS C 60068-1:1993 Environmental testing Part 1: General and guidance
- JIS C 6484:2005 Base materials for printed circuits -- Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)
JIS C 62137-1-2:2010 history
- 2010 JIS C 62137-1-2:2010 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test
