JIS C 62137-1-5:2011 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test
IEC 61188-5 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
IEC 61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly*， 2014-02-01 Update
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*， 2020-07-14 Update
JIS C 5603 Terms and definitions for printed circuits
JIS C 60068-1 Environmental testing -- Part 1: General and guidance*， 2016-04-20 Update
JIS C 6484:2005 Base materials for printed circuits -- Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test)
JIS C 62137-1-5:2011 history
2011JIS C 62137-1-5:2011 Surface mounting technology -- Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test