General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
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GB/T 30860-2014
Scope
This standard specifies the contact or non-contact profile test method for the surface roughness and cutting line marks of silicon wafers for solar cells (hereinafter referred to as silicon wafers). This standard applies to single crystal and polycrystalline silicon wafers produced by wire cutting process. If it needs to be applied to other products, it needs to be negotiated and agreed by the relevant parties.
GB/T 30860-2014 Referenced Document
GB/T 1031 Geometrical Product Specifications(GPS).Surface texture:Profile method.Surface roughness parameters and their values
GB/T 10610 Geometrical Product Specifications(GPS)Surface texture:Profile method.Rules and procedures for the assessment of surface texture
GB/T 14264 Semiconductor materials-Terms and definitions