This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.
SAE AMS3690C-2009 Referenced Document
ASTM D1002-05 Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading (Metal-to-Metal)*， 2024-04-19 Update
ASTM D471-06 Standard Test Method for Rubber Property-Effect of Liquids*， 2024-04-19 Update