Form This specification covers a two-component compound@ an epoxy resin base and a hardener@ in the form of a paste Application This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 ??(85 ??@ but usage is not limited to such applications Safety - Hazardous Materials While the materials@ methods@ applications@ and processes described or referenced in this specification may involve the use of hazardous materials@ this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved
SAE AMS3690D-2016 history
2016SAE AMS3690D-2016 Adhesive Compound@ Epoxy Room Temperature Curing
2009SAE AMS3690C-2009 Adhesive Compound, Epoxy, Room Temperature Curing
2000SAE AMS3690B-2000 Adhesive Compound, Epoxy Room Temperature Curing
1993SAE AMS3690B-1993 Adhesive Compound, Epoxy, Room Temperature Curing
1986SAE AMS3690A-1986 ADHESIVE COMPOUND@ EPOXY Room Temperature Curing (Reaffirmed)
1960SAE AMS3690-1960 ADHESIVE COMPOUND, EPOXY Room Temperature Curing