This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 85 degrees C (185 degrees F), but usage is not limited to such applications.
SAE AMS3690B-1993 history
2016SAE AMS3690D-2016 Adhesive Compound@ Epoxy Room Temperature Curing
2009SAE AMS3690C-2009 Adhesive Compound, Epoxy, Room Temperature Curing
2000SAE AMS3690B-2000 Adhesive Compound, Epoxy Room Temperature Curing
1993SAE AMS3690B-1993 Adhesive Compound, Epoxy, Room Temperature Curing
1986SAE AMS3690A-1986 ADHESIVE COMPOUND@ EPOXY Room Temperature Curing (Reaffirmed)
1960SAE AMS3690-1960 ADHESIVE COMPOUND, EPOXY Room Temperature Curing