BS EN 62137-1-4:2009 PDF

Scope: The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

BS EN 62137-1-4:2009 Referenced Document

IEC 60068-1 Environmental testing - Part 1: General and guidance*， 2013-10-01 Update
IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
IEC 61188-5 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
IEC 61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly*， 2014-02-01 Update
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
IEC 61249-2-7 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61760-1 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)*， 2020-07-14 Update

2009 BS EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Cyclic bending test