This part of GB/T 2424 refers to GB/T 2423.28-2005, GB/T 2423.32-2008 and IEC 60068-2-58:1989 to provide background information and suggestions for the normative writers.
GB/T 2424.17-2008 Referenced Document
GB/T 2423.28-2005 Environmental testing for electric and electronic products.Part2:Test methods-Test T:Soldering
GB/T 2423.32-2008 Environmental testing for electric and electronic products.Part 2:Test methods.Test Ta:Solderability test by the wetting balance method
IEC 60068-2-58:1989 Environmental testing; part 2: tests; test td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60249 Corrigendum 1 - First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials