IEC 60749-20:2008
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Standard No.

IEC 60749-20:2008

Release Date

2008

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60749-20:2020 RLV

Latest

IEC 60749-20:2020 RLV

Replace

IEC 47/1989/FDIS:2008 IEC 60749-20:2002 IEC 60749-20 Corrigendum 1:2003

IEC 60749-20:2008 history

• 0000 IEC 60749-20:2020 RLV
• 2008 IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• 2003 IEC 60749-20/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• 2002 IEC 60749-20:2002 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat