IEC 60749-20:2002
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Standard No.

IEC 60749-20:2002

Release Date

2002

Published By

International Electrotechnical Commission (IEC)

Status

Withdraw

Replace By

IEC 60749-20:2002/COR1:2003

Latest

IEC 60749-20:2020 RLV

Scope

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

IEC 60749-20:2002 history

• 0000 IEC 60749-20:2020 RLV
• 2008 IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• 1970 IEC 60749-20:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• 2002 IEC 60749-20:2002 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat