IEC 60749-20/COR1:2003
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Standard No.

IEC 60749-20/COR1:2003

Release Date

2003

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2008-12

Replace By

IEC 60749-20:2008

Latest

IEC 60749-20:2020 RLV

Scope

This is Technical Corrigendum 1 to IEC 60749-20-2002 (Semiconductor devices -Mechanical and climatic test methods -Part 20:Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat)

IEC 60749-20/COR1:2003 history

• 0000 IEC 60749-20:2020 RLV
• 2008 IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• 1970 IEC 60749-20:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
• 2002 IEC 60749-20:2002 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat