IEC 60691:2002
Thermal-links - Requirements and application guide

Standard No.
IEC 60691:2002
Release Date
2002
Published By
International Electrotechnical Commission (IEC)
Status
 2015-01
Replace By
IEC 60691:2002/AMD1:2006
Latest
IEC 60691:2023 RLV
Replace
IEC 32C/321/FDIS:2002 IEC 60691:1993 IEC 60691 AMD 1:1995 IEC 60691 AMD 2:2000 IEC 60691 Edition 2.2:2001
Scope
This standard applies to thermal fuses installed in electrical appliances, electronic equipment and similar components used in general indoor environments to prevent them from over-temperature under fault conditions. Note 1: Equipment is not necessarily designed to generate heat. Note 2: The effectiveness of preventing over-temperature is related to the installation location and method of the thermal fuse and the amount of current it carries. Note 3: It should be noted that the external creepage distances and clearances specified in Table 3 may in some cases be less than the requirements specified in some electrical or equipment standards. In this case, when installing thermal fuses in such equipment, measures should be taken to ensure that creepage distances and clearances meet the values specified in the corresponding equipment standards. This standard may also be used for thermal fuses used in non-indoor conditions if the climate and other conditions in which the thermal fuse is located are similar to those specified in this standard. This standard also applies to simple-shaped thermal fuses (such as fuse discs or fuse wires), as long as the molten material discharged during operation does not affect the safe use of the equipment, especially for handheld or portable equipment, regardless of its location. It will not affect their safe use. This standard applies to thermal fuses with a rated voltage not exceeding 690 V AC or DC and a rated current not exceeding 63 A. The purpose of this standard is to: a) Establish requirements for thermal fuses; b) Define test methods; c) Provide useful information for the application of thermal fuses in equipment. This standard does not apply to thermal fuses used under extreme conditions such as corrosive or explosive atmospheres. This standard does not apply to thermal fuses used on AC circuits with frequencies below 45 Hz or above 62 Hz.

IEC 60691:2002 Referenced Document

  • GB 14536.1-2008 Automatic electrical controls for household and similar use.Part 1:General requirements*2008-03-24 Update
  • GB 17196-1997 Connecting devices--Flat quick-connect terminations for electrical copper conductors--Safety requirements
  • GB 8898-2001 Audio,video and similar electronic apparatus--Safety requirements
  • GB/T 11026.1-2003 Electrical insulating materials-Properties of thermal endurance-Part 1:Ageing procedures and evaluation of test results*2003-10-09 Update
  • GB/T 5169.11-2006 Fire hazard testing for electric and electronic products.Part 11:Glowing/hot-wire based test methods.Glow-wire flammability test method for end-products*2006-12-19 Update
  • GB/T 5169.17-2002 Fire hazard testing for electric and electronic products--Part 17: 500W flame test methods
  • GB/T 5169.19-2006 Fire hazard testing for electric and electronic products.Part 19: Abnormal heat.Mould stress relief distortion test*2006-03-14 Update
  • GB/T 5169.21-2006 Fire hazard testing for electric and electronic products.Part 21:Abnormal heat.Ball pressure test*2006-12-19 Update
  • IEC 60112:2003 Method for the determination of the proof and the comparative tracking indices of solid insulating materials*2003-01-01 Update

IEC 60691:2002 history

  • 0000 IEC 60691:2023 RLV
  • 2019 IEC 60691:2015/AMD1:2019 Amendment 1 - Thermal-links - Requirements and application guide
  • 2019 IEC 60691:2019 Thermal-links - Requirements and application guide CONSOLIDATED EDITION
  • 2016 IEC 60691:2015/COR1:2016 Thermal-links - Requirements and application guide; Corrigendum 1
  • 2015 IEC 60691:2015 Thermal-links - Requirements and application guide
  • 2010 IEC 60691:2002/AMD2:2010 Thermal-links - Requirements and application guide; Amendment 2
  • 2010 IEC 60691:2010 Thermal-links - Requirements and application guide
  • 2006 IEC 60691:2002/AMD1:2006 Thermal-links - Requirements and application guide; Amendment 1
  • 2002 IEC 60691:2002 Thermal-links - Requirements and application guide
  • 2001 IEC 60691:2001 Thermal-links - Requirements and application guide
  • 1970 IEC 60691:1993/AMD2:2000 Amendment 2 - Thermal-links - Requirements and application guide
  • 1970 IEC 60691:1993/AMD1:1995 Amendment 1 - Thermal-links - Requirements and application guide
  • 1993 IEC 60691:1993 Thermal-Links - Requirements and Application Guide Second Edition; (Amendment 1-1995) (CAN/CSA-IEC E691-94) (CENELEC EN 60691: 1995) (Edition 2.0; Amendment 1-1995; Amendment 2-2000; CAN/CSA-IEC E691-94; CENELEC EN 60691-1995)
  • 1970 IEC 60691:1980 Thermal-links



Copyright ©2024 All Rights Reserved