IEC 60691:2002/AMD2:2010
Thermal-links - Requirements and application guide; Amendment 2

Standard No.
IEC 60691:2002/AMD2:2010
Release Date
2010
Published By
International Electrotechnical Commission (IEC)
Status
Replace By
IEC 60691:2015
Latest
IEC 60691:2023 RLV
Replace
IEC 32C/425/FDIS:2009
Scope
Scope and objectThis International Standard is applicable to thermal-links intended for incorporation in electrical appliances@ electronic equipment and component parts thereof@ normally intended for use indoors@ in order to protect them against excessive temperatures under abnormal conditions.NOTE 1 The equipment need not be designed to generate heat.NOTE 2 The effectiveness of the protection against excessive temperature logically depends upon the position and method of mounting of the thermal-link@ as well as upon the current which it is carrying.NOTE 3 Attention is drawn to the fact that the external creepage distances and clearances specified in Table 3 may in some cases be smaller than those required by certain appliance or equipment standards. In such cases@ additional means should be provided when a thermal-link is mounted in the equipment in order to adjust the creepage distances and clearances to the values required by the relevant equipment standard.This standard may be applicable to thermal-link for use under conditions other than indoors@ provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard.This standard may be applicable to thermal-links in their simplest forms (e.g. melting strips or wires)@ provided that molten materials expelled during function cannot adversely interfere with the safe use of the equipment@ especially in the case of hand-held or portable equipment@ irrespective of its position.This standard is applicable to thermal-links with a rated voltage not exceeding 690 V a.c. or d.c. and a rated current not exceeding 63 A.The object of this standard isa) to establlish uniform requirements for thermal-links@b) to define methods of test@c) to provide useful information for the application of thermal-links in equipment.This standard is not applicable to thermal-links used under extreme conditions such as corrosive or explosive atmospheres.This standard is not applicable to thermal-links to be used in circuits on a.c. with a frequency lower than 45 Hz or higher than 62 Hz.

IEC 60691:2002/AMD2:2010 history

  • 0000 IEC 60691:2023 RLV
  • 2019 IEC 60691:2015/AMD1:2019 Amendment 1 - Thermal-links - Requirements and application guide
  • 2019 IEC 60691:2019 Thermal-links - Requirements and application guide CONSOLIDATED EDITION
  • 2016 IEC 60691:2015/COR1:2016 Thermal-links - Requirements and application guide; Corrigendum 1
  • 2015 IEC 60691:2015 Thermal-links - Requirements and application guide
  • 2010 IEC 60691:2002/AMD2:2010 Thermal-links - Requirements and application guide; Amendment 2
  • 2010 IEC 60691:2010 Thermal-links - Requirements and application guide
  • 2006 IEC 60691:2002/AMD1:2006 Thermal-links - Requirements and application guide; Amendment 1
  • 2002 IEC 60691:2002 Thermal-links - Requirements and application guide
  • 2001 IEC 60691:2001 Thermal-links - Requirements and application guide
  • 1970 IEC 60691:1993/AMD2:2000 Amendment 2 - Thermal-links - Requirements and application guide
  • 1970 IEC 60691:1993/AMD1:1995 Amendment 1 - Thermal-links - Requirements and application guide
  • 1993 IEC 60691:1993 Thermal-Links - Requirements and Application Guide Second Edition; (Amendment 1-1995) (CAN/CSA-IEC E691-94) (CENELEC EN 60691: 1995) (Edition 2.0; Amendment 1-1995; Amendment 2-2000; CAN/CSA-IEC E691-94; CENELEC EN 60691-1995)
  • 1970 IEC 60691:1980 Thermal-links



Copyright ©2024 All Rights Reserved