IEC 60749-22:2002/COR1:2003
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Standard No.

IEC 60749-22:2002/COR1:2003

Release Date

2003

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-22:2002/COR1:2003

Scope

This is Technical Corrigendum 1 to IEC 60749-22-2002 (Semiconductor devices -Mechanical and climatic test methods -Part 22: Bond strength)

IEC 60749-22:2002/COR1:2003 history

• 2003 IEC 60749-22:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
• 2002 IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength