IEC 60749-32:2002/COR1:2003
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Standard No.

IEC 60749-32:2002/COR1:2003

Release Date

2003

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2010-11

Replace By

IEC 60749-32:2010

Latest

IEC 60749-32:2002/AMD1:2010

Scope

This is Technical Corrigendum 1 to IEC 60749-32-2002 (Semiconductor devices -Mechanical and climatic test methods -Part 32:Flammability of plastic-encapsulated devices(externally induced))

IEC 60749-32:2002/COR1:2003 history

• 2010 IEC 60749-32:2002/AMD1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• 2010 IEC 60749-32:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• 2003 IEC 60749-32:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• 2002 IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)