IEC 60749-31:2002/COR1:2003
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Standard No.

IEC 60749-31:2002/COR1:2003

Release Date

2003

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-31:2002/COR1:2003

Scope

This is Technical Corrigendum 1 to IEC 60749-31-2002 (Semiconductor devices -Mechanical and climatic test methods -Part31:Flammability of devices with plastic encapsulation (case of an internal cause of inflammation))

IEC 60749-31:2002/COR1:2003 history

• 2003 IEC 60749-31:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
• 2002 IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)