IEC 60749-3:2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Standard No.

IEC 60749-3:2017

Release Date

2017

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-3:2017

Scope

The purpose of this part of IEC 60749 is to verify that the materials@ design@ construction@ markings@ and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification@ process monitor@ or lot acceptance.

IEC 60749-3:2017 history

• 2017 IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• 2003 IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• 2002 IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination