IEC 60749-20:2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
- Standard No.
- IEC 60749-20:2020
- Release Date
- 2020
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60749-20:2020
IEC 60749-20:2020 history
- 0000 IEC 60749-20:2020 RLV
- 2008 IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
- 2003 IEC 60749-20/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
- 2002 IEC 60749-20:2002 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
