This specification specifies the general requirements, quality assurance regulations, delivery preparation and instructions for chemical mechanical polishing machines (hereinafter referred to as equipment). This specification applies to the design, production, inspection, acceptance and ordering of chemical mechanical polishing machines in the micro-assembly thin film process and silicon wafer polishing process. Other micro-assembly manufacturing process equipment or similar equipment in other industries can also be implemented with reference.
SJ 21127-2016 Referenced Document
GB 2894-2008 Safety signs and guideline for the use
GB/T 4025-2003 Basic and safety principles for man-machine interface,marking and identification Coding principles for indication devices and actuators
GB/T 6621-1995 Test methods for surface flatness of silicon polished slices
GJB 1210-1991 Implementation of grounding, bonding and shielding design
GJB 151A-1997 Electromagnetic emission and sensitivity requirements for military equipment and subsystems
GJB 152A-1997 Electromagnetic emission and sensitivity measurements of military equipment and subsystems
GJB 1653-1993 Specification for packaging of electronic and electrical equipment, accessories and spare parts
SJ 21127-2016 history
2016SJ 21127-2016 General specification for chemical mechanical polishing equipment