This part of IEC 61747 serves as a blank detail specification (BDS) for the IEC quality assessment system and contains requirements for style and layout and minimum content of the detail specifications. These requirements are applicable when the detail specification is published (e.g. for a standard product).
IEC 61747-3-1:2015 Referenced Document
IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)