IEC 60749-14:2003
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Standard No.

IEC 60749-14:2003

Release Date

2003

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-14:2003

Replace

IEC 47/1701/FDIS:2003 IEC 60749:1996 IEC 60749 AMD 1:2000 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002 IEC/PAS 62184:2000

Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and

IEC 60749-14:2003 history

• 2003 IEC 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)