GB/T 31475-2015
Requirements for solder paste for high-quality interconnections in electronics assembly (English Version)

Standard No.

GB/T 31475-2015

Language

Chinese, Available in English version

Release Date

2015

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 31475-2015

Scope

This standard specifies the classification, technical requirements, test methods, inspection rules and product marking, packaging, transportation and storage of solder paste for high-quality internal interconnection of electronic assemblies (solder paste for short). This standard applies to solder pastes used for soldering surface mount components and electronic circuit interconnections.

GB/T 31475-2015 Referenced Document

• GB/T 10574.1 Methods for chemical analysis of tin-lead solders--Determination of tin content
• GB/T 10574.10 Methods for chemical analysis of tin-lead solders—Part 10：Determination of cadmium content—Flame atomic absorption spectrometry and Na2EDTA titration method*， 2017-10-14 Update
• GB/T 10574.11 Methods for chemical analysis of tin-lead solders—Part 11：Determination of phosphorus content—Crystal violet phosphorus-vanadium-molybdeum heteropoly acid spectrophotometry*， 2017-10-14 Update
• GB/T 10574.12 Methods for chemical analysis of tin-lead solders—Part 12：Determination of sulfur content—High frequency combustion with infrared absorption method*， 2017-10-14 Update
• GB/T 10574.13 Methods for chemical analysis of tin-lead solders—Part 13：Determination of antimony,bismuth,iron,arsenic,copper,silver,zinc,aluminium,cadmium,phosphorous and gold contents—Inductively coupled plasma atomic emission spectrometric method*， 2017-10-14 Update
• GB/T 10574.14 Methods for chemical analysis of tin-lead solders—Part 14：Determination of tin, lead,antimony,bismuth,silver,copper,zinc,cadmium and arsenic content—Optical emission spectrometry*， 2017-10-14 Update
• GB/T 10574.2 Methods for chemical analysis of Tin-lead solders--Determination of antimony content
• GB/T 10574.3 Method for chemical analysis of tin-lead solder - Determination of bismuth content
• GB/T 10574.4 Methods for chemical analysis of tin-lead solders--Determination of iron content
• GB/T 10574.5 Determination of arsenic content by chemical analysis method of tin-lead solder
• GB/T 10574.6 Methods for chemical analysis of tin-lead solders--Determination of copper content
• GB/T 10574.7 Methods for chemical analysis of tin-lead solders—Part 7：Determination of silver content—Flame atomic absorption spectrometry and potassium thiocyanate potentiometric titration*， 2017-10-14 Update
• GB/T 10574.8 Methods for chemical analysis of tin-lead solders—Part 8：Determination of zinc content—Flame atomic absorption spectrometric method*， 2017-10-14 Update
• GB/T 10574.9 Methods for chemical analysis of tin-lead solders—Part 9：Determination of aluminium content—Graphite furnace atomic absorption spectrometric method*， 2017-10-14 Update
• GB/T 2040 Copper and copper alloy sheet*， 2017-05-31 Update
• GB/T 2828.1 Inspection procedure by count sampling part 1: Lot by lot inspection sampling plan retrieved by acceptance quality limit (AQL)
• GB/T 31474 Soldering fluxes for high-quality interconnections in electronics assembly
• GB/T 31476 Requirements for solders for high-quality interconnections in electronics assembly

GB/T 31475-2015 history

• 2015 GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly