GB/T 31474-2015
Soldering fluxes for high-quality interconnections in electronics assembly (English Version)
- Standard No.
- GB/T 31474-2015
- Language
- Chinese, Available in English version
- Release Date
- 2015
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Latest
- GB/T 31474-2015
- Scope
- This standard specifies the classification, technical requirements, test methods, testing rules and product identification, packaging, transportation and storage of high-quality internal interconnection fluxes for electronic assembly (flux for short). This standard is mainly applicable to soldering fluxes for printed board assembly and soldering of electrical and electronic circuit contacts.
GB/T 31474-2015 Referenced Document
- GB 190 Packing symbol of dangerous goods
- GB/T 191 Packaging.Pictorial marking for handling of goods
- GB/T 2040 Copper and copper alloy sheet*， 2017-05-31 Update
- GB/T 21652 Copper and copper alloy wire*， 2017-05-31 Update
- GB/T 2423.16 Environmental testing—Part 2: Test methods—Test J and guidance: Mould growth*， 2022-07-11 Update
- GB/T 2423.32-2008 Environmental testing for electric and electronic products.Part 2:Test methods.Test Ta:Solderability test by the wetting balance method
- GB/T 8145 Gum rosin*， 2021-10-11 Update
GB/T 31474-2015 history
- 2015 GB/T 31474-2015 Soldering fluxes for high-quality interconnections in electronics assembly
