GB/T 31352-2014
Test methods for warp of sapphire substrates (English Version)

Standard No.

GB/T 31352-2014

Language

Chinese, Available in English version

Release Date

2014

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 31352-2014

Scope

This standard specifies the test method for the warpage of sapphire cutting discs, grinding discs and polishing discs (hereinafter referred to as sapphire substrate discs). This standard applies to the warpage test of sapphire substrates with a diameter of 50.8 mm to 304.8 mm and a thickness of not less than 200 μm.

GB/T 31352-2014 Referenced Document

• GB/T 14264 Semiconductor materials-Terms and definitions
• GB/T 2828.1 Inspection procedure by count sampling part 1: Lot by lot inspection sampling plan retrieved by acceptance quality limit (AQL)
• GB/T 6620 Test method for measuring warp on silicon slices by noncontact scanning

GB/T 31352-2014 history

• 2014 GB/T 31352-2014 Test methods for warp of sapphire substrates