KS C IEC 60749-22:2004
Semiconductor devices-Mechanical and climatic test methods-Part 22:Bond strength

Standard No.

KS C IEC 60749-22:2004

Release Date

2004

Published By

Korean Agency for Technology and Standards (KATS)

Status

Withdraw

Replace By

KS C IEC 60749-22:2020

Latest

KS C IEC 60749-22:2020

Scope

This standard is applicable to semiconductor devices (discrete devices and integrated circuits). The purpose of this standard is to

KS C IEC 60749-22:2004 history

• 2020 KS C IEC 60749-22:2020 Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength
• 2004 KS C IEC 60749-22:2004 Semiconductor devices-Mechanical and climatic test methods-Part 22:Bond strength