KS C IEC 60749-22:2020
Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength

Standard No.

KS C IEC 60749-22:2020

Release Date

2020

Published By

Korean Agency for Technology and Standards (KATS)

Latest

KS C IEC 60749-22:2020

KS C IEC 60749-22:2020 history

• 2020 KS C IEC 60749-22:2020 Semiconductor devices — Mechanical and climatic test methods — Part 22: Bond strength
• 2004 KS C IEC 60749-22:2004 Semiconductor devices-Mechanical and climatic test methods-Part 22:Bond strength