KS C IEC 60749-16:2006
Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)

Standard No.

KS C IEC 60749-16:2006

Release Date

2006

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced

Replace By

KS C IEC 60749-16-2006(2016)

Latest

KS C IEC 60749-16-2021

Scope

The purpose of this specification is to prevent dropped particles such as ceramic chips, bonding wire pieces, or solder balls inside the cavity elements.

KS C IEC 60749-16:2006 history

• 2021 KS C IEC 60749-16-2021 Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)
• 0000 KS C IEC 60749-16-2006(2016)
• 2006 KS C IEC 60749-16:2006 Semiconductor devices－Mechanical and climatic test methods－Part 16：Particle impact noise detection(PIND)