DS/EN 60749-32+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
This part of IEC 60749 is applicable to semiconductor device (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device.
DS/EN 60749-32+Corr.1:2004 history
2010DS/EN 60749-32/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
2004DS/EN 60749-32+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)