DS/EN 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Standard No.

DS/EN 60749-19:2003

Release Date

2003

Published By

Danish Standards Foundation

Status

Be replaced 2010-12

Replace By

DS/EN 60749-19/A1:2010

Latest

DS/EN 60749-19/A1:2010

Scope

This part of 60749 determines (see note) the integrity of materials and procedures used to attach semiconductors die to package headers or other substrates (for the purpose of this test method, the term ""semiconductors die"" should be taken to include passive elements) The test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10mm2. it is also not applicable to flip chip technology or to flexible substrates.

DS/EN 60749-19:2003 history

• 2010 DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• 2003 DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength