DS/EN 60749-19/A1:2010
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Standard No.

DS/EN 60749-19/A1:2010

Release Date

2010

Published By

Danish Standards Foundation

Latest

DS/EN 60749-19/A1:2010

Scope

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

DS/EN 60749-19/A1:2010 history

• 2010 DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• 2003 DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength