IEC 60749-29:2011
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

Standard No.
IEC 60749-29:2011
Release Date
2011
Published By
International Electrotechnical Commission (IEC)
Latest
IEC 60749-29:2011
Replace
IEC 47/2083/FDIS:2011 IEC 60749-29:2003
Scope
"Scope and object This part of IEC 60749 covers the I-test and the overvoltage latch-up testing of integrated circuits. This test is classified as destructive. The purpose of this test is to establish a method for determining integrated circuit (IC) latchup characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing ""no trouble found"" (NTF) and ""electrical overstress"" (EOS) failures due to latch-up. This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established. The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2"

IEC 60749-29:2011 history

  • 2011 IEC 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
  • 2003 IEC 60749-29:2003 Dispositifs à semiconducteurs Méthodes d?essais mécaniques et climatiques Partie 29: Essai de verrouillage (Edition 1.0; Replaces IEC PAS 62181)
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test



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