This specification covers the requirements for electrodeposition copper. This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required nor permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing, but usage is not limited to such applications.
SAE AMS2418H-2011 Referenced Document
ASTM B499-09 Standard Test Method for Measurement of Coating Thicknesses by the Magnetic Method: Nonmagnetic Coatings on Magnetic Basis Metals*， 2024-04-19 Update
ASTM B567-98 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method
ASTM B568-98 Standard Test Method for Measurement of Coating Thickness by X-Ray Spectrometry
ASTM B734-97 Standard Specification for Electrodeposited Copper for Engineering Uses
ASTM B764-04 Standard Test Method for Simultaneous Thickness and Electrode Potential Determination of Individual Layers in Multilayer Nickel Deposit (STEP Test)*， 2024-04-19 Update
ASTM E376-06 Standard Practice for Measuring Coating Thickness by Magnetic-Field or Eddy-Current (Electromagnetic) Examination Methods*， 2024-04-19 Update
ASTM E376-11 Standard Practice for Measuring Coating Thickness by Magnetic-Field or Eddy-Current (Electromagnetic) Testing Methods*， 2024-04-19 Update
ASTM F519-10 Standard Test Method for Mechanical Hydrogen Embrittlement Evaluation of Plating/Coating Processes and Service Environments*， 2024-04-19 Update
SAE AMS2759/9-1996 Hydrogen Embrittlement Relief (Baking) of Steel Parts