ASTM B734-97
Standard Specification for Electrodeposited Copper for Engineering Uses

Standard No.

ASTM B734-97

Release Date

1997

Published By

American Society for Testing and Materials (ASTM)

Status

Be replaced

Replace By

ASTM B734-97(2003)e1

Latest

ASTM B734-97(2023)

Scope

1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.

1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.

1.3 This specification is not intended for electrodeposited copper when used for electroforming.

ASTM B734-97 history

• 2023 ASTM B734-97(2023) Standard Specification for Electrodeposited Copper for Engineering Uses
• 2018 ASTM B734-97(2018) Standard Specification for Electrodeposited Copper for Engineering Uses
• 1997 ASTM B734-97(2013) Standard Specification for Electrodeposited Copper for Engineering Uses
• 1997 ASTM B734-97(2008) Standard Specification for Electrodeposited Copper for Engineering Uses
• 1997 ASTM B734-97(2003)e1 Standard Specification for Electrodeposited Copper for Engineering Uses
• 1997 ASTM B734-97 Standard Specification for Electrodeposited Copper for Engineering Uses