IEC 60749-30:2005
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Standard No.

IEC 60749-30:2005

Release Date

2005

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced

Replace By

IEC 60749-30:2011

Latest

IEC 60749-30:2020 RLV

Replace

IEC 47/1790/FDIS:2004 IEC/PAS 62182:2000

Scope

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical

IEC 60749-30:2005 history

• 0000 IEC 60749-30:2020 RLV
• 2011 IEC 60749-30:2005/AMD1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• 2011 IEC 60749-30:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• 2005 IEC 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing