This standard specifies the terms and definitions, requirements, test methods, inspection rules, marking, packaging, transportation and storage of solder paste. This standard applies to solder paste for electronic product soldering.
SJ/T 11186-2009 Referenced Document
GB/T 1.1 Directives for standardization—Part 1: Rules for the structure and drafting of standardizing documents*, 2020-03-31 Update
GB/T 1.2 Directives for standardization—Part 2:Drafting rules of standardizing documents based on ISO/IEC standardizing documents*, 2020-11-19 Update
GB/T 1.22 Directives for work of standardization Unit2:Methodology for the development of standards Part22:Rule of "reference to standards"
GB/T 1.4 Standardization Work Guidelines Chemical Analysis Method Standard Compilation Provisions
GB/T 1.6 Regulations on Compilation of Terminology Standards in Standardization Work Guidelines
GB/T 1480-1995 Determination of particle size for metallic powders--Dry sieving
GB/T 3260.1-2000 Methods for chemical analysis of tin Determination of copper content
GB/T 3260.10-2000 Methods for chemical analysis of tin Determination of sulphur content
GB/T 3260.11-2000 Methods for chemical analysis of tin Determination of cadmium content
GB/T 3260.2-2000 Methods for chemical analysis of tin Determination of iron content
GB/T 3260.3-2000 Methods for chemical analysis of tin Determination of iron content
GB/T 3260.4-2000 Methods for chemical analysis of tin Determination of lead content
GB/T 3260.5-2000 Methods for chemical analysis of tin Determination of antimony content
GB/T 3260.6-2000 Methods for chemical analysis of tin Determination of arsenic content
GB/T 3260.7-2000 Methods for chemical analysis of tin Determination of aluminum content
GB/T 3260.9-2000 Methods for chemical analysis of tin Determination of lead,copper and zinc content