GB/T 6621-2009 (English Version) PDF

Standard No.: GB/T 6621-2009
Language: Chinese, Available in English version
Release Date: 2009
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 6621-2009
Replace: GB/T 6621-1995

Scope: This standard specifies the method for measuring the flatness of silicon polished wafers with capacitive displacement sensors. Cutting wafers, grinding wafers, and corrosion wafers can also refer to this method. This standard is suitable for measuring the surface flatness of silicon polished wafers with standard diameters of 76mm, 100mm, 125mm, 150mm, 200mm, resistivity not greater than 200Ω•cm and thickness not greater than 1000μm and visually describing the contour of the silicon wafer surface.

GB/T 6621-2009 history

2009 GB/T 6621-2009 Testing methods for surface flatness of silicon slices
1995 GB/T 6621-1995 Test methods for surface flatness of silicon polished slices