IEC 60749-33:2004
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (Edition 1.0; Replaces IEC PAS 62172:2000)
- Standard No.
- IEC 60749-33:2004
- Release Date
- 2004
- Published By
- International Electrotechnical Commission (IEC)
- Status
- Replace By
- IEC 60749-33:2005
- Latest
- IEC 60749-33:2005
- Scope
- Scope and object The unbiased autoclave test is performed to evaluate the moisture resistance integrity of nonhermetic packaged solid-state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure@ humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors passing through it. This test is used to identify failure mechanisms internal to the package and is destructive.
IEC 60749-33:2004 history
- 2005 IEC 60749-33:2005 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
- 2004 IEC 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (Edition 1.0; Replaces IEC PAS 62172:2000)
