IEC PAS 62137-3:2008
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
- Standard No.
- IEC PAS 62137-3:2008
- Release Date
- 2008
- Published By
- International Electrotechnical Commission (IEC)
- Status
- Latest
- IEC PAS 62137-3:2008
- Replace By
- IEC 62137-3:2011
- Scope
- This guidance describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material. The regions of the joints to be tested are shown in Figure 1. The test methods given here are applicable to evaluate the strength of joints of a component mounted on printed wiring board but not to test the mechanical strength of components themselves. The test conditions for accelerated tests (rapid temperature change and high temperature tests) may exceed the maximum allowable temperature range for a component. The lead-free solders have different properties from those of the conventional tin-lead eutectic solder. The reliability of soldered joints using lead-free solder may be reduced by the composition of the solder used, the shape of terminals and surface treatment. The factors affecting the joint reliability using Sn96,5Ag3Cu,5 solder are shown in Figure 2. This solder has the properties of higher melting temperature and harder than the tin-lead eutectic solder and the solid is not easily deformed. Consequently, the stress induced to the joint becomes higher than the tin-lead eutectic solder. These properties may induce break of a soldered joint by accelerated temperature changes, or mechanical stress.
IEC PAS 62137-3:2008 history
- 2008 IEC PAS 62137-3:2008 Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
IEC PAS 62137-3:2008 Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints was changed to IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints.
