IEC 62137-3:2011
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Standard No.

IEC 62137-3:2011

Release Date

2011

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 62137-3:2011

Replace

IEC 91/986/FDIS:2011 IEC/PAS 62137-3:2008

Scope

This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD)@ array type devices and leaded devices@ and lead insertion type devices using various types of solder material alloys.

IEC 62137-3:2011 history

• 2011 IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints