(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Scope
The method described in this document applies to all application specific reliability
testing for solid state components with known failure mechanisms where the test
duration and conditions vary based on application variables. This document does not
cover reliability tests that are characterization based or essentially go / no-go type tests,
for example, ESD, latch-up, or electrical over stress. Also, it does not attempt to cover
every failure mechanism or test environment, but does provide a methodology that can
be extended to other failure mechanisms and test environments.
The purpose of this document is to provide a method for developing an application
specific reliability evaluation methodology based on the use conditions the solid state
device is expected to experience in the field. It assumes that the failure mechanisms
and models, relevant to the product being tested, are a known entity.
JEDEC JESD94A-2008 Referenced Document
JEDEC JEP148 Reliability Qualification of Semiconductor Devices Based on Physics of Failure Risk and Opportunity Assessment