(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
This test method applies primarily to moisture resistance evaluations and robustness testing. Samples are
subjected to a condensing, highly humid atmosphere under pressure to force moisture into the package to
uncover weaknesses such as delamination and metallization corrosion. This test is used to evaluate new
packages or packages that have undergone changes in materials (e.g. mold compound, die passivation) or
design (e.g. die/paddle sizes). However, this test should not be applied on laminate or tape based
packages i.e. FR4 material, polyimide tape or equivalent.