GB/T 8446.2-2004 Heat sink for power semiconductor device Part 2:Measuring method of thermal resistance and input fluid-output fluid pressure difference (English Version)
This part of GB/T 8446 gives the principle of testing the thermal resistance and flow resistance of radiators, and specifies the test system requirements, test conditions and basic measurement procedures for air-cooled, self-cooled and water-cooled radiators. This part applies to the testing of thermal resistance and flow resistance of cast (including extruded) heat sinks, profile heat sinks and heat pipe heat sinks for power semiconductor devices.
GB/T 8446.2-2004 history
2022GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
2004GB/T 8446.2-2004 Heat sink for power semiconductor device Part 2:Measuring method of thermal resistance and input fluid-output fluid pressure difference
1987GB/T 8446.2-1987 Measuring method of thermal resistance and input fluid-output fluid pressure difference of heat sink for power semiconductor device