GB/T 8446.2-2022
Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop (English Version)

Standard No.

GB/T 8446.2-2022

Language

Chinese, Available in English version

Release Date

2022

Published By

国家市场监督管理总局、中国国家标准化管理委员会

Latest

GB/T 8446.2-2022

Replace

GB/T 8446.2-2004

Scope

This document gives the terms and definitions and measurement methods of thermal resistance and flow resistance of heat sinks for power semiconductor devices. This document is applicable to the measurement of thermal resistance and flow resistance of heat sinks (including cast, extruded, profiled and heat pipe heat sinks) for power semiconductor devices.

GB/T 8446.2-2022 Referenced Document

• GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators

GB/T 8446.2-2022 history

• 2022 GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
• 2004 GB/T 8446.2-2004 Heat sink for power semiconductor device Part 2:Measuring method of thermal resistance and input fluid-output fluid pressure difference
• 1987 GB/T 8446.2-1987 Measuring method of thermal resistance and input fluid-output fluid pressure difference of heat sink for power semiconductor device

GB/T 8446.2-2022 -All Parts