ASTM B734-97(2018)
Standard Specification for Electrodeposited Copper for Engineering Uses

Standard No.
ASTM B734-97(2018)
Release Date
2018
Published By
American Society for Testing and Materials (ASTM)
Status
Replace By
ASTM B734-97(2023)
Latest
ASTM B734-97(2023)
Scope
1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations. 1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes. 1.3 This specification is not intended for electrodeposited copper when used for electroforming. 1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

ASTM B734-97(2018) Referenced Document

  • ASTM B320 Standard Practice for Preparation of Iron Castings for Electroplating*2019-04-01 Update
  • ASTM B374 Standard Terminology Relating to Electroplating
  • ASTM B487 Standard Test Method for Measurement of Metal and Oxide Coating Thickness by Microscopical Examination of Cross Section
  • ASTM B499 Standard Test Method for Measurement of Coating Thicknesses by the Magnetic Method: Nonmagnetic Coatings on Magnetic Basis Metals
  • ASTM B504 Standard Test Method for Measurement of Thickness of Metallic Coatings by the Coulometric Method*2023-05-01 Update
  • ASTM B507 Standard Practice for Design of Articles to Be Electroplated on Racks
  • ASTM B568 Standard Test Method for Measurement of Coating Thickness by X-Ray Spectrometry*2021-04-01 Update
  • ASTM B571 Standard Practice for Qualitative Adhesion Testing of Metallic Coatings
  • ASTM B588 Standard Test Method for Measurement of Thickness of Transparent or Opaque Coatings by Double-Beam Interference Microscope Technique
  • ASTM B602 Standard Test Method for Attribute Sampling of Metallic and Inorganic Coatings
  • ASTM B678 Standard Test Method for Solderability of Metallic-Coated Products
  • ASTM B697 Standard Guide for Selection of Sampling Plans for Inspection of Electrodeposited Metallic and Inorganic Coatings*2021-10-01 Update
  • ASTM B762 Standard Test Method of Variables Sampling of Metallic and Inorganic Coatings
  • ASTM B765 Standard Guide for Selection of Porosity Tests for Electrodeposits and Related Metallic Coatings
  • ASTM B832 Standard Guide for Electroforming with Nickel and Copper*2023-11-01 Update
  • ASTM B849 Standard Specification for Pre-Treatments of Iron or Steel for Reducing Risk of Hydrogen Embrittlement
  • ASTM B850 Standard Guide for Post-Coating Treatments of Steel for Reducing the Risk of Hydrogen Embrittlement*2022-05-01 Update
  • ASTM B851 Standard Specification for Automated Controlled Shot Peening of Metallic Articles Prior to Nickel, Autocatalytic Nickel, or Chromium Plating, or as Final Finish
  • ASTM D3951 Standard Practice for Commercial Packaging
  • ASTM F519 Standard Test Method for Mechanical Hydrogen Embrittlement Evaluation of Plating Processes and Service Environments

ASTM B734-97(2018) history

  • 2023 ASTM B734-97(2023) Standard Specification for Electrodeposited Copper for Engineering Uses
  • 2018 ASTM B734-97(2018) Standard Specification for Electrodeposited Copper for Engineering Uses
  • 1997 ASTM B734-97(2013) Standard Specification for Electrodeposited Copper for Engineering Uses
  • 1997 ASTM B734-97(2008) Standard Specification for Electrodeposited Copper for Engineering Uses
  • 1997 ASTM B734-97(2003)e1 Standard Specification for Electrodeposited Copper for Engineering Uses
  • 1997 ASTM B734-97 Standard Specification for Electrodeposited Copper for Engineering Uses
Standard Specification for Electrodeposited Copper for Engineering Uses



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