IEC 60749-25:2003
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Standard No.

IEC 60749-25:2003

Release Date

2003

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60749-25:2003

Replace

IEC 47/1696/FDIS:2003 IEC 60749:1996 IEC 60749 AMD 1:2000 IEC 60749 AMD 2:2001 IEC 60749 Edition 2.2:2002 IEC/PAS 62178:2000

Scope

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physic

IEC 60749-25:2003 history

• 2003 IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling