IPC 9691-2005
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
- Standard No.
- IPC 9691-2005
- Release Date
- 2005
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Status
- 2007-08
- Latest
- IPC 9691-2005
- Replace By
- IPC 9691A-2007
- Scope
- This document is the product of the IPC Electrochemical Migration (ECM) Task Group. It was drafted to provide guidance regarding how the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance test can best be used for evaluating the effects of mechanical stress, laminate material fracturing, ionic contamination, moisture content prior to press lamination, and other material processing characteristics on conductive anodic filament (CAF) growth. This CAF test method provides a proven standard for determining the risk of THB failure within rather than on the surface of printed circuit boards (PCBs), typically filament formation along the boundary between the resin and laminate reinforcement.
IPC 9691-2005 history
- 2005 IPC 9691-2005 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
