- Standard No.
- IPC 9691A-2007
- Release Date
- 2007
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Replace
-
IPC 9691-2005
- Scope
- This document is the product of the IPC Electrochemical
Migration (ECM) Task Group. It was drafted to provide
guidance regarding how the IPC-TM-650, Method 2.6.25,
Conductive Anodic Filament (CAF) Resistance test can
best be used for evaluating the effects of mechanical stress,
laminate material fracturing, ionic contamination, moisture
content prior to press lamination, and other material processing
characteristics on conductive anodic filament
(CAF) resistance test method results. This CAF test method
provides a proven standard for determining the risk of temperature,
humidity and bias (THB) failure within rather
than on the surface of printed circuit boards (PCBs), typically
filament formation along the boundary between the
resin and laminate reinforcement.
IPC 9691A-2007 history
- 2005 IPC 9691-2005 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
IPC 9691A-2007 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) has been changed from IPC 9691-2005 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing).