This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.
SAE AMS2690C-1988 history
2017SAE AMS2690D-2017 Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
2011SAE AMS2690C-2011 Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
2001SAE AMS2690C-2001 Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates
1993SAE AMS2690B-1993 PARALLEL GAP WELDING Micro-electronic Interconnections To Thin Film Substrates
1988SAE AMS2690C-1988 (Noncurrent)Parallel Gap Welding Micro-Electronic Interconnections to Thin Film Substrates
1988SAE AMS2690B-1988 Parallel Gap Welding Micro-Electronic Interconnections to Thin Film Substrates
1982SAE AMS2690A-1982 PARALLEL GAP WELDING Microelectronic Interconnections To Thin Film Substrates
1968SAE AMS2690-1968 PARALLEL GAP WELDING OF MICROELECTRONIC INTERCONNECTIONS TO THIN FILM SUBSTRATES