SAE AMS2690D-2017
Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
- Standard No.
- SAE AMS2690D-2017
- Release Date
- 2017
- Published By
- SAE - SAE International
- Latest
- SAE AMS2690D-2017
- Scope
- Purpose: This specification defines the equipment@ procedures@ and requirements for joining leads by parallel gap resistance welding. Application: For attaching leads by parallel gap resistance welding in the assembly of micro-electronic circuitry to thin film substrates.
SAE AMS2690D-2017 history
- 2017 SAE AMS2690D-2017 Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
- 2011 SAE AMS2690C-2011 Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
- 2001 SAE AMS2690C-2001 Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates
- 1993 SAE AMS2690B-1993 PARALLEL GAP WELDING Micro-electronic Interconnections To Thin Film Substrates
- 1988 SAE AMS2690C-1988 (Noncurrent)Parallel Gap Welding Micro-Electronic Interconnections to Thin Film Substrates
- 1988 SAE AMS2690B-1988 Parallel Gap Welding Micro-Electronic Interconnections to Thin Film Substrates
- 1982 SAE AMS2690A-1982 PARALLEL GAP WELDING Microelectronic Interconnections To Thin Film Substrates
- 1968 SAE AMS2690-1968 PARALLEL GAP WELDING OF MICROELECTRONIC INTERCONNECTIONS TO THIN FILM SUBSTRATES
